This plasma cleaner is a versatile plasma cleaning tool to remove contamination from the surface of samples such as plastic packages, wafers and glass slides in sample preparation and device fabrication. Our systems also can be used for photoresist ashing, ink removal, surface activation and wettability improvement.
Specification:
Model
TCH-2S-RF
Input Power
AC 220V, 50/60 Hz
Working current
No more than 1.2A
RF power
0-300W adjustable
RF frequency
13,56 MHz
Frequency offset
Less than 0.2KHz
Control Panel
Control Function: Clean time, RF Power, Vacuum Pump
Process Control
MCU Automatic and manual mode
Plasma Chamber
Φ100mm×270mm stainless steel chamber
2 Liter Capacity
Characteristic impedance
50 Ohm,Automatic matching
Vacuum degree
1Pa -30Pa
Vacuum pump
2XZ-2
Cleaning time
1 to 100 minutes ( adjustable)
Flow rate
10—160ml/min(adjustable)
Inert Gas
Many inert gases can be chosen for plasma cleaning such as N2, Ar, Air, and Mixed gas depended on what kind material will be treated. ( not included in the package)
Gas channel no.
Two channel gas mixer
Vacuum chamber temperature
Less than 65°C
Cooling type:
Forced cooling
Dimensions
560x540x550mm
Net Weight
45kg
Warranty
One year limited warranty with lifetime support
